恭賀本系許棟樑教授團隊參加: Joint Conference of the 3rd Global TRIZCON 2012 and International Conference on Systematic Innovation (第三屆全球萃智和系統化創新研討會) 與 Global Competition on Systematic Innovation (全球系統化創新競賽) 獲兩項創新專案金牌 如下:

l Vacuum Device Mechanism for Wafer Breakage Avoidance By D. Daniel Sheu (許棟樑) & Jealousy Hong (洪柏璿)

http://www.systematic-innovation.org/gcsi/gcsi2012/Details/17.htm

l Using TRIZ to Solve Lead Frame Delamination in Component Package By  D. Daniel Sheu  (許棟樑)  & Yu -Chih Kuo (郭宇智)

       http://www.systematic-innovation.org/gcsi/gcsi2012/Details/21.htm